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description the power plcc-4 smt led with lens are high-perfor - mance plcc-4 package size smt leds targeted mainly in automotive & electronics signs and signals (ess) markets. these top-mount single-chip packages with focused radia - tion ofer high brightness in beam direction and are excel - lent for interior automotive, indoor and outdoor sign and industrial applications. with additional lens in 30 variants, these products are especially ftting to applications for trafc lights, chmsl and displays. the plcc-4 package family is able to dissipate heat better compared to the plcc-2 packages. in proportion to this increase in driving current, this family of leds is able to produce higher light output compared to the convention - al plcc-2 smt leds. as an extension of the standard fat top plcc-4 smt leds, the power plcc-4 with lens device is able to provide fo - cused beams within narrow viewing angles (30 ) meeting the markets requirements for focused radiation and high brightness in beam directions. the power plcc-4 smt led with 30 is ideal for panel, push button, or general backlighting in automotive interi - or & exterior, sign, ofce equipment, industrial equipment and home appliances applications. this package design coupled with careful selection of component materials al - low the power plcc-4 smt led with lens to perform with higher reliability in a larger temperature range -40 c to 100 c. this high reliability feature is crucial to allow the power plcc-4 smt led with lens to do well in harsh en - vironments such as its target automotive & ess markets. the power plcc4 smt led with lens package is also de - signed to be compatible with both ir-solder re-fow and through-the-wave soldering. hsmx-a43x-xxxxx surface mount led indicator data sheet features ? industry standard plcc-4 ? high reliability led package ? high brightness using allngap and ingan dice tech - nologies ? high optical efciency ? narrow viewing angle at 30 ? available in 8mm carrier tape on 7-inch reel ? compatible with both ir and ttw soldering process applications interior automotive ? instrument panel backlighting ? central console backlighting ? cabin backlighting ? navigation and audio system ? dome lighting ? push button backlighting exterior automotive ? turn signals ? chmsl ? rear combination lamp ? side repeaters electronic signs and signals ? interior and exterior full color sign ? variable message sign ? garden lighting ofce automation, home appliances, industrial equipment ? front panel backlighting ? push button backlighting ? display backlighting caution: hsmn, hsmm-a43x-xxxxx leds are class 2 esd sensitive. please observe appropriate precautions during handling and processing. refer to avago application note an-1142 for additional details.
2 the new avago technologies power plcc-4 smt led with 30 lens will carry the part number hsmx- a43xxxxxx. the high brightness alingap and ingan dice technologies utilized will provide the product brightness that meets the automotive and ess markets requirements. the lens package will complement and complete the existing alin - gap & ingan color standard power-plcc-4 led that ava - go technologies ofers, providing customers an extra lens option from one supplier. to facilitate easy pick and place assembly, the leds are packed in eia-compliant tape and reel. every reel will be shipped in single intensity and color bin (except for red color), to provide close uniformity package dimensions note: all dimensions in mm electrical connection between all cathodes is recommended 2.8 0.2 2.2 0.2 0.7 0.1 3.5 0.2 0.8 0.3 0.5 0.1 0.80 0.1 0.1 typ. 3.87 max. package marking 3.2 0.2 -ve -ve +ve -ve
3 device selection guide color part number min. i v (mcd) typ. i v (mcd) max. i v (mcd) test current (ma) dice technology red hsmc-a430-w50m1 1125.00 2300.00 3550.00 50 alingap hsmc-a431-x90m1 2240.00 4000.00 7150.00 50 alingap red orange hsmj-a430-w50m1 1125.00 2300.00 3550.00 50 alingap hsmj-a431-x90m1 2240.00 4500.00 7150.00 50 alingap orange hsml-a431-x90m1 2240.00 4500.00 7150.00 50 alingap amber hsma-a430-w90m1 1400.00 3000.00 4500.00 50 alingap hsma-a431-y00m1 2850.00 5000.00 - 50 alingap hsma-a431-x90m1 2240.00 4700.00 7150.00 50 alingap HSMA-A431-13NM1 7150.00 - 14000.00 50 alingap green hsmm-a430-x90m2 2240.00 7150.00 30 ingan blue hsmn-a430-v50m2 715.00 2240.00 30 ingan notes: 1. the luminous intensity i v , is measured at the mechanical axis of the lamp package. the actual peak of the spatial radiation pattern may not be aligned with this axis. 2. iv tolerance 12% part numbering system hsm x 1 - a x 2 x 3 x 4 - x 5 x 6 x 7 x 8 x 9 p ack ag ing option c olor bin s elec tion i n t ensit y bin s elec t d evic e specific c onfigur a tion p ack age t ype led chip c olor
4 absolute maximum ratings (t a =25 c) parameters hsmc/a hsmv hsmk/m/n dc forward current [1] 70 ma 70 ma 30 ma peak forward current [2] 200 ma 200 ma 90 ma power dissipation 180 mw 240 mw 114 mw reverse voltage 5v 5v 4v junction temperature 110 c operating temperature - 40 c to + 100 c storage temperature - 40 c to + 100 c notes: 1. derate linearly as shown in figure 4. 2. duty factor = 10%, frequency = 1khz optical characteristics (t a = 25 c) color part number dice technology peak wavelength l peak (nm) dominant wavelength l d [1] (nm) viewing angle 2 q ? [2] (degrees) luminous efcacy h v [3] (lm/w) typical typical typical typical red hsmc-a43x alingap 635 626 30 150 red orange hsmj-a43x alingap 621 615 30 240 hsmv-a430 alingap 623 617 30 263 orange hsml-a431 alingap 609 605 30 320 amber hsma-a43x alingap 592 590 30 480 green hsmm-a430 ingan 518 525 30 500 blue hsmn-a43x ingan 468 470 30 75 cyan hsmk-a43x ingan 500 502 30 285 notes: 1. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the color of the device. 2. q ? is the of-axis angle where the luminous intensity is ? the peak intensity. 3. radiant intensity, ie in watts / steradian, may be calculated from the equation ie = i v / h v , where i v is the luminous intensity in candelas and h v is the luminous efcacy in lumens / watt. electrical characteristics (t a = 25 c) part number forward voltage v f (volts)@i f =50 ma reverse voltage v r @100 m a reverse voltage v r @10 m a minimum typical maximum minimum minimum hsmc/j/l/a 1.7 2.2 2.5 5 - hsmv 1.7 2.8 3.4 5 - part number forward voltage v f (volts)@i f =30 ma reverse voltage v r @100 m a reverse voltage v r @10 m a minimum typical maximum minimum minimum hsmk/m/n 2.7 3.9 4.6 - 5
5 0 0.2 0.4 0.6 0.8 1 380 430 480 530 580 630 680 730 780 wavelength - nm relative intensity alingap red alingap red orange alingap amber ingan blue ingan green alingap orange cyan ingan 0 10 20 30 40 50 60 70 80 0 1 2 3 4 5 forward voltage - v forward current - ma hsmv hsmc/j/l/a hsmk/m/n 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 dc forward current - ma relative luminous intensity (normalized at 50 ma) 0 0.2 0.4 0.6 0.8 1.0 1.2 0 5 10 15 20 25 30 35 dc forward current - ma relative luminous intensity (normalized at 30 ma) figure 1. relative intensity vs. wavelength figure 2. forward current vs. forward voltage figure 3a. relative intensity vs. forward current (alingap). figure 3b. relative intensity vs. forward current (ingan).
6 0 80 0 20 60 80 120 maximum forward current ? ma ambient temperature ? c 40 40 60 30 300c/w 20 70 100 10 350c/w 470c/w 50 0 0 20 60 80 120 maximum forward current ? ma ambient temperature ? c 40 20 30 15 300c/w 10 35 100 5 350c/w 470c/w 25 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 30 60 90 angular displacement - degrees normalized intensity figure 5. radiation pattern figure 4a. maximum forward current vs. ambient temperature. derated based on t j max= 110c (alingap) figure 4b. maximum forward current vs. ambient temperature. derated based on t j max= 110c (ingan)
7 2.60 (0.103) solder resist represents electrical connectivity between pads 4.50 (0.178) y x 0.40 (0.016) x 0.50 (0.020) y 1.10 (0.043) 1.50 (0.059) dimensions in mm (inches). x x 0.5 (0.020) y y 1.0 (0.039) 2.0 (0.079) 2.0 (0.079) 6.0 (0.236) 3.0 (0.118) 2.8 (0.110) 6.1 (0.240) dimensions in mm (inches). represents electrical connectivity between pads solder resist figure 6a. recommended soldering pad pattern (ir refow). figure 6b. recommended soldering pad pattern (ttw).
8 vacuum pick-up tool soft tip nozzle inner diameter size: 1.0 to 1.5 mm 1.25mm radius contour 240c max. 20 sec. max. 3c/sec. max. 120 sec. max. time temperature 183c 100-150c ?6c/sec. max. 60-150 sec. 3c/sec. max. temperature time 10 to 20 sec. 255 c +5c -0c 125c +/- 25c 217c 3c/sec max. max. 120 sec. -6c/sec max. 60-150 sec. laminar wave bottom side of pc board hot air knife turbulent wave fluxing preheat 0 10 20 30 50 100 150 200 250 30 40 50 time ? seconds temperature ? c 60 70 80 90 100 top side of pc board conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100 c pcb) solder wave temperature = 245 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma note: allow for boards to be sufficiently cooled before exerting mechanical force. figure 9. recommended wave soldering profle. figure 7. soft tip vacuum pick-up tool for extracting smt led components from carrier tape. note: for detail information on refow soldering of avago surface mount leds, do refer to avago application note an 1060 surface mounting smt led indicator components. figure 8a. recommended snpb refow soldering profle figure 8b. recommended pb-free refow soldering profle.
9 200 mm min. for ? 180 reel. 200 mm min. for ? 330 reel. trailer component leader 480 mm min. for ?180 reel. 960 mm min. for ? 330 reel. c a user feed direction 2.00 0.05 1.75 0.10 5.50 0.05 .388 0.02 3.52 0.10 3.70 0.10 3.00 0.10 8 max 12.00 + 0.30 - 0.10 8.00 0.10 4.00 0.10 1.24 32 max 8 max 32 max ? 1.50 0.10 cathode side user feed direction printed label figure 11. tape dimensions figure 10. tape leader and trailer dimensions figure 12. reeling orientation.
10 intensity bin select (x 5 x 6 ) individual reel will contain parts from one half bin only x 5 min iv bin x 6 0 full distribution 2 2 half bins starting from x 5 1 3 3 half bins starting from x 5 1 4 4 half bins starting from x 5 1 5 5 half bins starting from x 5 1 6 2 half bins starting from x 5 2 7 3 half bins starting from x 5 2 8 4 half bins starting from x 5 2 9 5 half bins starting from x 5 2 intensity bin limits bin id min (mcd) max (mcd) u1 450.00 560.00 u2 560.00 715.00 v1 715.00 900.00 v2 900.00 1125.00 w1 1125.00 1400.00 w2 1400.00 1800.00 x1 1800.00 2240.00 x2 2240.00 2850.00 y1 2850.00 3550.00 y2 3550.00 4500.00 z1 4500.00 5600.00 z2 5600.00 7150.00 11 7150.00 9000.00 12 9000.00 11250.00 21 11250.00 14000.00 22 14000.00 18000.00 tolerance of each bin limit = 12% moisture sensitivity this product is qualifed as moisture sensitive level 2a per jedec j-std-020. precautions when handling this moisture sensitive product is important to ensure the reli - ability of the product. do refer to avago application note an5305 handling of moisture sensitive surface mount devices for details. a. storage before use - unopen moisture barrier bag (mbb) can be stored at <40c/90%rh for 12 months. if the actual shelf life has exceeded 12 months and the hic indicates that baking is not required, then it is safe to refow the leds per the original msl rating. - it is not recommended to open the mbb prior to assem - bly (e.g. for iqc). b. control after opening the mbb - the humidity indicator card (hic) shall be read immedi - ately upon opening of mbb. - the leds must be kept at <30c / 60%rh at all time and all high temperature related process including solder - ing, curing or rework need to be completed within 672 hours. c. control for unfnished reel - for any unuse leds, they need to be stored in sealed mbb with desiccant or desiccator at <5%rh. d. control of assembled boards - if the pcb soldered with the leds is to be subjected to other high temperature processes, the pcb need to be stored in sealed mbb with desiccant or desiccator at <5%rh to ensure no leds have exceeded their foor life of 672 hours. e. baking is required if: - 10% is not blue and 5% hic indicator turns pink. - the leds are exposed to condition of >30c / 60% rh at any time. - the leds foor life exceeded 672 hours. recommended baking condition: 605c for 20 hours.
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2014 avago technologies. all rights reserved. obsoletes av01-0313en av02-0208en - january 23, 2014 amber min. (nm) max. (nm) a 582.0 584.5 b 584.5 587.0 c 587.0 589.5 d 589.5 592.0 e 592.0 594.5 f 594.5 597.0 orange min. (nm) max. (nm) a 597.0 600.0 b 600.0 603.0 c 603.0 606.0 d 606.0 609.0 e 609.0 612.0 red/orange min. (nm) max. (nm) a 611.0 616.0 b 616.0 620.0 red min. (nm) max. (nm) full distribution tolerance of each bin limit = 1nm packaging option (x 8 x 9 ) option test current package type reel size m1 50ma top mount 13 inch m2 30ma top mount 13 inch forward voltage bin table for hsmv C a43x-xxxxx only bin min. max. va 1.9 2.2 vb 2.2 2.5 vc 2.5 2.8 vd 2.8 3.1 ve 3.1 3.4 tolerance for each bin limit = 0.1v color bin select (x 7 ) individual reel will contain parts from 1 full bin only x7 0 full distribution z a and b only y b and c only w c and d only v d and e only u e and f only t f and g only s g and h only q a, b and c only p b, c and d only n c, d and e only m d, e and f only l e, f and g only k f, g and h only 1 a, b, c and d only 2 e, f g and h only color bin limits blue min. (nm) max. (nm) a 460.0 465.0 b 465.0 470.0 c 470.0 475.0 d 475.0 480.0 cyan min. (nm) max. (nm) a 490.0 495.0 b 495.0 500.0 c 500.0 505.0 d 505.0 510.0 green min. (nm) max. (nm) a 515.0 520.0 b 520.0 525.0 c 525.0 530.0 d 530.0 535.0

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